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Sonics Expands Operations into Armenia; New Engineering Center
Highlights Revenue Growth Strategy
MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)----Sonics Inc., the premier
supplier of system-on-chip (SoC) SMART(TM) Interconnects, today
announced the opening of an engineering design center in Armenia as
part of a company-wide strategy aimed at supporting revenue growth.
"As Sonics completes its transition from a start-up company previously
fo cused on engineering critical first products, to an emerging growth
company now focused on enhancing established market positions and
expanding its customer base, we are directing the company's resources
to support the expected revenue growth," said Grant Pierce president
and CEO.
The Armenia design center will be used for both product development
and sustaining infrastructure projects. "The expansion into Armenia
enables Sonics to utilize a team of talented engineers while managing
development costs moving forward as our business expands," said
Pierce.
The company also announced that Geert Rosseel, Senior Vice President
of Development Programs, has assumed the additional responsibility of
managing Sonics' Applications Engineering Group.
About Sonics
Sonics, Inc. is a leading provider of SMART Interconnects that deliver
high SoC design predictability and increase design efficiency. Major
semiconductor and systems companies including Broadcom, Samsung, Texas
Instruments and Toshiba have applied Sonics SMART Interconnects in
leading products in the wireless, digital multimedia and
communications markets. Sonics is a privately held company funded by
Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt
Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information,
see www.sonicsinc.com.
SMART is a trademark of Sonics, Inc. All other trademarks and
registered trademarks are the property of their respective owners.
Acclaim Public Relations Nancy Sheffield, 408-269-0849
[email protected]
01/07/2005 14:52 ET
Highlights Revenue Growth Strategy
MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)----Sonics Inc., the premier
supplier of system-on-chip (SoC) SMART(TM) Interconnects, today
announced the opening of an engineering design center in Armenia as
part of a company-wide strategy aimed at supporting revenue growth.
"As Sonics completes its transition from a start-up company previously
fo cused on engineering critical first products, to an emerging growth
company now focused on enhancing established market positions and
expanding its customer base, we are directing the company's resources
to support the expected revenue growth," said Grant Pierce president
and CEO.
The Armenia design center will be used for both product development
and sustaining infrastructure projects. "The expansion into Armenia
enables Sonics to utilize a team of talented engineers while managing
development costs moving forward as our business expands," said
Pierce.
The company also announced that Geert Rosseel, Senior Vice President
of Development Programs, has assumed the additional responsibility of
managing Sonics' Applications Engineering Group.
About Sonics
Sonics, Inc. is a leading provider of SMART Interconnects that deliver
high SoC design predictability and increase design efficiency. Major
semiconductor and systems companies including Broadcom, Samsung, Texas
Instruments and Toshiba have applied Sonics SMART Interconnects in
leading products in the wireless, digital multimedia and
communications markets. Sonics is a privately held company funded by
Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt
Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information,
see www.sonicsinc.com.
SMART is a trademark of Sonics, Inc. All other trademarks and
registered trademarks are the property of their respective owners.
Acclaim Public Relations Nancy Sheffield, 408-269-0849
[email protected]
01/07/2005 14:52 ET